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Dimensity 8000 smartphone parameters – beats Snapdragon 870 SoC


Taiwanese chipmaker, MediaTek, will release a flagship processor, Dimensity 8000. The performance of this chip will be below Dimensity 9000 but above the popular Snapdragon 870 SoC. The Dimensity 8000 uses TSMC’s 5nm manufacturing process and it uses a 4 + 4 dual architecture. This chip has 4 Cortex A78 large cores and 4 Cortex A55 small cores. The CPU frequency is up to 2.75GHz, and the GPU is Mali-G510 MC6. This chip supports 2K 120Hz or 1080P 168Hz resolution as well as LPDDR5 + UFS 3.1 storage combination.

Dimensity 8000

According to popular Weibo tech blogger @DCS, an engineering model of a smartphone using this chip is now available. The specific parameters include a 6.6-inch FHD+ screen, a 120Hz high refresh rate, and 12GB RAM. The device also comes with a 16MP front camera as well as a 50MP + 50MP + 2MP triple rear camera. According to @DCS, this smartphone will be official after the Spring Festival and its price will be around 2000 yuan ($314). However, he did not disclose the brand name.

More importantly, MediaTek Dimensity 8000’s AnTuTu comprehensive score hit 750,000 points. It surpasses the Snapdragon 870, which has an AnTuTu comprehensive score of around 700,000 points. It is worth noting that Redmi, Realme, and other brands have officially confirmed that they will launch smartphones with this chip.

MediaTek continues to lead the smartphone chip market

Counterpoint Research has released a report on shipments of smartphone chipsets in the third quarter. The data showed that MediaTek widened its lead over Qualcomm, cementing its leading position in the market. Some success was also achieved by Unisoc, which overtook Samsung; taking fourth place in the market of SoCs for smartphones.

MediaTek has managed to strengthen its position largely due to the strong demand for 4G chips. Qualcomm continues to lead the 5G smartphone chipset market with 62% of its 5G cellular connectivity chips shipped. Apple managed to maintain its third place among mobile chip suppliers, while Samsung moved from fourth to fifth place; losing its position to Unisoc. The company has been able to achieve success by forging partnerships; with brands such as Realme, Motorola, ZTE, Samsung, and Honor.

HiSilicon’s share has dropped significantly from 13% in the third quarter of last year to 2% this year. There is no doubt that the decline is due to US sanctions against Huawei; which have made it difficult for its subsidiary HiSilicon to manufacture cutting-edge chips.

With the launch of the Snapdragon 8 Gen1, Dimensity 9000, and other chips, there will be some competition in the market.


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